AOI-SPI
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JUKI 3D solder paste yekuongorora muchina, 3D bhodhi yekuona muchina RV-2-3DH (AOI/SPI)
Overwhelming speed
Kuvandudza kwakakura mukutarisa tact ine yakakwira-pixel (12 miriyoni pixels)
Kururama kunoshamisa
Kushandisa yakakwirira-resolution lenses inovandudza kuongororwa kweiyo Ultra-compact zvikamu.
Kureruka kwekushandisa rating
Maitiro maitiro ari nyore kushandisa uye kugadzira, kubva kune vanotanga kusvika kune vakuru vakuru
Visual inspection automation
RV yakatevedzana, inogona zvakare kushandiswa kuyerwa
Nekuvandudza kushanda kwechirimwa chose
Kuwana kugona kwefekitori yese kuburikidza nesystem yekubatanidza
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JUKI 3D solder paste yekuongorora muchina, 3D bhodhi yekuona yekuongorora muchina (AOI/SPI) RV-2-3D
Kuziva kwekumhanyisa neazvino 3D unit.Kuwana 0.41 sec / FOV uye 34% kuvandudzwa tichienzanisa neyakare modhi.
Kugadziriswa kwehurefu 0.1 μm, Kudzokororwa 10 μm *Kuziva kwekuvandudzwa kwakakosha.Nekuvandudzwa kwehunyanzvi hutsva, wana mufananidzo wakajeka uye wepamusoro we3D.
Pamusoro peiyo yapfuura 2D template uye maitiro maitiro, yakawedzera ichangoburwa 3D template modhi.
Uyezve, kuvandudza kwealgorithm nyowani yekuongorora fillet.*0402 chip
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JUKI 3D solder paste yekuongorora muchina RV-2
Bvisa Vision Capturing System
Nyika dzepamusoro-kirasi yepamusoro kuita
Kuongorora kumhanya = 0.2 sec / furemu
Easy programming
CCC (Central Confirmation Control)*
SPC ( Statistical process Control) *
Inotsigira 3D kuongorora *