JUKI 3D solder paste yekuongorora muchina, 3D bhodhi yekuona muchina RV-2-3DH (AOI/SPI)

Features:

Overwhelming speed

Kuvandudza kwakakura mukutarisa tact ine yakakwira-pixel (12 miriyoni pixels)

Kururama kunoshamisa

Kushandisa yakakwirira-resolution lenses inovandudza kuongororwa kweiyo Ultra-compact zvikamu.

Kureruka kwekushandisa rating

Maitiro maitiro ari nyore kushandisa uye kugadzira, kubva kune vanotanga kusvika kune vakuru vakuru

Visual inspection automation

RV yakatevedzana, inogona zvakare kushandiswa kuyerwa

Nekuvandudza kushanda kwechirimwa chose

Kuwana kugona kwefekitori yese kuburikidza nesystem yekubatanidza

Online kubvunza Taura nesu

Product Detail

*1 Izvi zvinogona kuitwa nesarudzo.

Saizi yebhodhi		50mm×50mm-410mm×300mm 50mm×50mm-630mm×300mm (chiito kune refu bhodhi)*1
Test resolution		12μm (yakajairwa kugadziriswa)/5μm (yakakwirira resolution)*1
Mufananidzo angle		48.0×36.0mm, 20.0×15.0mm*1
Zvinhu zvekuongorora		Shorting, shear, polarity, side-reverse, unsoldered solder, bhiriji, solder uwandu, kuisa chikamu kusiiwa, kuzivikanwa kwemavara*1
FOV (Optimum condition)	2D	0.2sec/1 skrini
	3D	61.8cm²/sec