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JUKI 3D solder paste yekuongorora muchina, 3D board yekuona muchina (AOI/SPI) RV-2-3D ​​Featured Image

JUKI 3D solder paste yekuongorora muchina, 3D bhodhi yekuona yekuona muchina (AOI/SPI) RV-2-3D

Features:

Kuziva kwekumhanyisa neazvino 3D unit.Kuwana 0.41 sec / FOV uye 34% kuvandudzwa tichienzanisa neyakare modhi.

Kugadziriswa kwehurefu 0.1 μm, Kudzokororwa 10 μm *Kuziva kwekuvandudzwa kwakakosha.Nekuvandudzwa kwehunyanzvi hutsva, wana mufananidzo wakajeka uye wepamusoro we3D.

Pamusoro peiyo yapfuura 2D template uye maitiro maitiro, yakawedzera ichangoburwa 3D template modhi.

Uyezve, kuvandudza kwealgorithm nyowani yekuongorora fillet.*0402 chip


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Product Detail

Product Tags

Zita remuenzaniso RV-2-3D
PWB saizi 50mm×50mm - 410mm×300mm
50mm×50mm - 630mm×300mm (yakareba saizi PWB)*
FOV (zvakanakisa) P-3D AOI 0.41s / furemu
Chisarudzo chekuongorora 15μm (Standard resloution), 10μm(High resolution)*
Chisarudzo chekuongorora 15μm ( Standard resloution ), 10μm ( High resolution )*
Chinhu chekuongorora Chipo chisipo,Position displacement, Polarity, Front/back reversal, Unsoldered,Bridge, Quantity of solder, Kushaikwa kwechikamu, Kuzivikanwa kwehunhu*

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