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Zvinhu zvinokanganisa kusaenzana kupisa kwe lead-isina reflow soldering

Zvikonzero zvikuru zvekupisa kusina kuenzana kwezvikamu muSMT lead-free reflow soldering process ndezvi: lead-free reflow soldering product load, conveyor bhandi kana heater edge pesvedzero, uye mutsauko mukupisa kwesimba kana kupisa kutorwa kwe lead-isina reflow soldering zvikamu.

①Kukonzeresa kwemavhoriyamu akasiyana ekurodha chigadzirwa.Iko kugadziridzwa kweiyo tembiricha curve ye lead-isina reflow soldering inofanirwa kufunga kuwana yakanaka kudzokorora pasi pe-isina-mutoro, mutoro uye akasiyana mitoro zvinhu.Chinhu chinotakura chinotsanangurwa se: LF = L / (L + S);uko L=kureba kwechikamu chakaunganidzwa uye S=pakati pakati pezvikamu zvakaunganidzwa.

②Muhovhoni isina-lead-free reflow, bhandi rekutakura rinovawo hurongwa hwekupisa kupisa uchidzokorodza kutakura zvigadzirwa zve lead-isina reflow soldering.Mukuwedzera, mamiriro ekupisa kupisa akasiyana pamucheto uye pakati pechikamu chekupisa, uye tembiricha pamucheto kazhinji yakaderera.Pamusoro pezvakasiyana tembiricha zvinodiwa zveimwe tembiricha zone muchoto, tembiricha iri panzvimbo imwechete yemutoro inosiyanawo.

③ Kazhinji, PLCC neQFP dzine simba guru rekupisa kupfuura discrete chip component, uye zvakanyanya kuoma kupinza zvikamu zvakakura-nzvimbo pane zviduku zviduku.

Kuti uwane mibairo inodzokororwa mune inotungamira-isina reflow soldering process, iyo yakakura iyo inotakura chinhu, inotowedzera kuoma.Kazhinji iyo yakanyanya kuremerwa chinhu che lead-isina reflow oveni inotangira kubva 0.5-0.9.Izvi zvinoenderana nemamiriro ezvinhu echigadzirwa (chikamu chesoldering density, akasiyana substrates) uye akasiyana mamodheru ezve reflow furnaces.Kuti uwane yakanaka welding mhedzisiro uye kudzokorora, ruzivo runoshanda rwakakosha.


Nguva yekutumira: Nov-21-2023