Iyo inotungamira-isina reflow soldering process ine zvakanyanya kukwirira zvinodiwa paPCB pane inotungamira-yakavakirwa maitiro.Kupisa kwekupisa kwePCB kuri nani, tembiricha yegirazi Tg yakakwira, iyo tembiricha yekuwedzera yakaderera, uye mutengo wakaderera.
Lead-yemahara reflow soldering zvinodiwa zvePCB.
Mune reflow soldering, Tg inzvimbo yakasarudzika yemapolymers, iyo inotarisisa tembiricha yakakosha yezvivakwa zvezvinhu.Munguva yeSMT solder process, tembiricha yekutengesa yakakwira zvakanyanya kupfuura Tg yePCB substrate, uye tembiricha isina-lead solder iri 34 ° C yakakwirira kupfuura iyo ine lead, izvo zvinoita kuti zvive nyore kune deformation yekupisa kwePCB uye kukuvara. kune zvikamu panguva yekutonhora.Iyo base PCB zvinhu zvine Tg yakakwirira inofanira kusarudzwa nemazvo.
Munguva yekupisa, kana tembiricha ikawedzera, iyo Z-axis ye multilayer chimiro PCB haienderane neCTE pakati peiyo laminated zvinhu, girazi fiber, uye Cu munzira yeXY, izvo zvinounza kushushikana kwakawanda paCu, uye mu. kesi dzakakomba, zvinokonzeresa kuti plating yegomba rakagadzirwa nesimbi riputse uye kukonzeresa kukanganisa.Nekuti zvinoenderana nezvakawanda zvakasiyana, senge PCB layer nhamba, ukobvu, laminate zvinhu, soldering curve, uye Cu kugovera, kuburikidza nejometry, nezvimwe.
Mukushanda kwedu chaiko, takatora matanho ekukunda kuputsika kwegomba rakagadzirwa nesimbi ye multilayer board: semuenzaniso, resin / girazi fiber inobviswa mukati megomba pamberi pe electroplating mune recess etching process.Kuti usimbise simba rekubatanidza pakati pemadziro ane metallized gomba uye multi-layer board.Kudzika kwe etch ndeye 13 ~ 20µm.
Muganho tembiricha yeFR-4 substrate PCB i240°C.Kune zvigadzirwa zviri nyore, tembiricha yepamusoro ye235 ~ 240 ° C inogona kusangana nezvinodiwa, asi kune zvigadzirwa zvakaoma, zvingada 260 ° C kuti itengeswe.Naizvozvo, mahwendefa akakora uye zvigadzirwa zvakaomarara zvinoda kushandisa yakakwira tembiricha inodzivirira FR-5.Nekuti mutengo weFR-5 wakakwira, kune zvakajairwa zvigadzirwa, composite base CEMn inogona kushandiswa kutsiva FR-4 substrates.CEMn ndeye yakaomesesa inoumbwa nheyo yemhangura-yakapfeka laminate iyo nzvimbo uye musimboti wakagadzirwa nezvinhu zvakasiyana.CEMn kwenguva pfupi inomiririra mhando dzakasiyana.
Nguva yekutumira: Jul-22-2023